100% material declaration data sheet PQG160 pk122 (v1.2.1) october 19, 2006 material declaration data sheet average weight: 5.8 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.07366 1.27% silicon 7440-21-3 100.00 0.07366 die attach material 0.00928 0.16% silver 7440-22-4 78.00 0.0072384 epoxy (ep) trade secret 22.00 0.0020416 mold compound 4.92304 84.88% epoxy resin (ep) trade secret 9.00 0.4430736 phenolic resin trade secret 7.00 0.3446128 carbon black 1333-86-4 0.50 0.0246152 silica 60676-86-0 82.50 4.061508 bismuth 7440-69-9 max 1.00 0.0492304 leadframe 0.73486 12.67% copper 7440-50-8 98.85 0.72640911 chromium 7440-47-3 0.30 0.00220458 tin 7440-31-5 0.25 0.00183715 zinc 7440-66-6 0.60 0.00440916 leadframe plating 0.00638 0.11% silver 7440-22-4 100.00 0.00638 bond wire 0.01392 0.24% gold 7440-57-5 100.00 0.01392 ext. plating 0.03886 0.67 % tin 7440-31-5 100.00 0.03886 pk122 (v1.2.1) october 19, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? PQG160 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/08/06 1.0 initial release. 7/05/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. 10/19/06 1.2.1 editorial c hange; corrected typo in substance description. pk122 (v1.2.1) october 19, 2006
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